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3M™ MetPak™ 2-FB Backplane Connector

The connecting solution for the data communications and telecommunications industry requirements for high density high pin count and interconnect functionality. Packaging system is based on a 2 mm metric pitch (4 and 5 rows) in accordance with proposed hard metric equipment practice and Futurebus+®* standards. Available in standard or inverse system.

* Futurebus+ is a trademark of the IEEE.