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Enhances the polishing process

3M™ Fixed Abrasives for CMP

High Performance for Advanced STI & HKMG

3M™ Fixed Abrasives for Chemical Mechanical Planarization* (CMP) provide outstanding dishing, erosion and low defects resulting in higher yields for advanced technology nodes.

Our chemical mechanical polishing solutions deliver improved planarization, without slurries, during the STI CMP process.

*Chemical Mechanical Planarization (CMP) is a process of smoothing surfaces by a combination of chemical and mechanical means.