Temporary Wafer Bonding Adhesives
Building the Future in 3D
3M™ Adhesives for Temporary Wafer Bonding enabling faster, easier more reliable ways to build tomorrow's semiconductors.
For temporary wafer bonding during wafer thinning and additional TSV processes, 3M Wafer Support System (WSS) is proven in high‐volume manufacturing. 3M WSS combines proprietary 3M temporary wafer bonding adhesive technologies with world class equipment.