3M™ Thermally Conductive Adhesives
High Adhesion, Low Thermal Impedance
3M™ Thermally Conductive Adhesives have minimal odor and superior structural strength. Dispensing is easy for high output, in-line automated manufacturing, and manual applications. Adhesive flows and fills micro-spaces on surfaces. Ultra-thin bond lines help achieve low thermal impedance.
Our thermally conductive epoxies and urethanes are ideal for applications requiring high adhesive strength and excellent surface wet-out. They can provide a thermal interface between IC packages or PCBs and heat sinks or other cooling devices as well be used as thermally conductive potting compounds.