A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | 0-9

3M™ Compounds and Sealing Kits

Telecom cable splicing compounds and sealing kits - including 3M™ High Gel Reenterable Encapsulant (Non-Urethane) 8882 which provides better penetration of splice bundles at low temperatures due to its lower viscosity and longer gel time, and 3M™ Scotchcast™ Encapsulating and Blocking Compound 4407 developed for splice encapsulation and pressure blocking.